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3.1.2 Preparation Process The preparation process of electroformed diamond-nickel composite membrane is as follows: Step 1: Prepare plating solution; Step 2: Pour a certain amount of diamond micropowder into the plating solution and stir with an electric magnetic stirrer for about 1 hour. The diamond particles are uniformly dispersed and fully wetted in the plating solution; the third step: calculating and adjusting the cathode current according to the design area of ​​the cathode and the cathode current density on the cathode; the fourth step: the processed cathode mold Electrolytic plating into the plating tank for electroplating; Step 5: After plating for a certain period of time, take out the cathode mold, rinse it with water, and dry it; Step 6: Remove the film and perform performance test. The process flow is shown in Figure 2. 
The electroplating process parameters include: diamond content in the plating solution, cathode current density, bath temperature, deposition time, pH value, electrode spacing, diamond particle size, stirring speed and position. Studies have shown that these parameters have a certain impact on the quality of the composite plating. Using orthogonal experiment method, the diamond content in the plating solution ranges from 14 to 20 g/L, the cathode current density ranges from 0.5 to 1.5 A/dm2, the plating solution temperature is from 40 to 60 ° C, the deposition time is from 1 to 4 h, and the pH value is 3. 5 to 4.2, the electrode spacing is 10 to 15 cm, the stirring speed is 180 to 220 r/min, and the stirring paddle is at the lower portion of the plating solution. Three kinds of artificial diamond micro powders of W3.5, W7 and W10 were selected for experiments. 3.1.3 Analysis of factors affecting the quality of composite membranes The composite membrane samples were tested by digital electronic micrometer, SEM (scanning electron microscope) and XRD (X-ray diffraction). The results showed: (1) Cathodic current density versus composite The diamond particle content, surface morphology, microscopic strain, and deposition rate of the film have a great influence on the film. As the current density increases, the deposition rate of the composite film increases. The content of diamond particles in the composite film increases rapidly first, reaching a peak at 1.3-2.5 A/dm2, and then increasing the cathode current density, and the diamond particle content decreases. . Moreover, under our experimental conditions, the microscopic strain of the composite film decreases as the cathode current density increases. Therefore, controlling current density is the key to depositing high quality composite films. (2) The content of diamond particles in the composite film increases with the increase of diamond concentration in the plating solution. However, when the diamond concentration is greater than 18g/L, the diamond particle content in the composite film increases slowly with the increase of diamond concentration. And there is a tendency to approach saturation. (3) Under the condition that the cathode current density and the diamond particle content in the plating solution are the same, the stirring speed and the position of the stirring paddle have a great influence on the uniformity of the diamond density and the particle distribution in the deposited composite film. The optimum stirring speed is 180-220r/min, and the optimum stirring paddle position is the lower part of the plating solution. (4) The inclination angle of the cathode suspension has a great influence on the content of diamond particles in the composite film. When the inclination angle is 45°, the content of diamond particles is the highest and the distribution is uniform. The cathode suspension orientation has a great influence on the thickness uniformity of the deposited composite film. During the electroplating process, the cathode is intermittently rotated by 90° along its own plane, and electroplating is continued to obtain a composite film having a uniform thickness. (5) The effect of temperature on the diamond abrasive content, nickel grain size, microscopic strain, film deposition rate and preferred growth orientation of nickel grains in the composite film was studied in the temperature range of 20-70 °C. As the temperature increases, the diamond content increases and reaches a maximum at 50 °C. Subsequently, the diamond content begins to decrease with increasing temperature; as the temperature increases, the microscopic strain decreases, and the microstrain at 50 °C The minimum, then, as the temperature increases, the microscopic strain increases; as the temperature increases, the deposition rate shows a downward trend; the nickel grain size also decreases. In addition, the deposition temperature significantly affects the preferential growth of the crystal face, especially at lower deposition temperatures. Therefore, in order to prepare a high-precision diamond-nickel ultrathin cutting blade, the electroforming temperature should be in the range of 40 to 50 °C. The results of the above orthogonal experiments are analyzed as follows: (1) During the composite electrodeposition process, the diamond particles are transported by the flowing liquid to the surface of the cathode while being covered by the electrodeposited nickel. When the deposition conditions are the same, especially when the stirring rate is the same, the diamond content in the composite film peaks at different cathode current densities. The main reason is that the deposition rate of nickel varies with the change of cathode current density. At a small cathode current density, the deposition rate of nickel is too small, and part of the diamond particles contacting the surface of the cathode have not been buried, that is, washed away by the flowing liquid, resulting in a lower diamond content in the composite film; As the density increases, the deposition rate of nickel increases, and more and more diamond particles are buried in the surface of the cathode, thereby increasing the diamond content in the composite film. However, if the cathode current density is greater than 2.5 A/dm2, the diamond content decreases, because the hydrogen evolution of the cathode is intensified at a large cathode current density, and the hydrogen bubbles on the surface of the cathode weaken the adhesion of the diamond particles on the surface of the nickel deposit layer. The content of diamond particles in the composite film is decreased. (2) As the concentration of diamond in the plating solution increases, the number of diamond particles transported and attached to the surface of the cathode increases, and the probability of encapsulation of the diamond particles by nickel ion electrodeposition increases; on the other hand, with the plating solution The increase in the amount of solid particles added and the increase in cathodic polarization result in a rapid increase in the rate of composite electrodeposition, resulting in a rapid increase in the content of diamond particles in the composite film. However, since the formation of the diamond-nickel composite film is formed by the diamond particles first attached to the surface of the cathode, and then the nickel ions are mechanically encapsulated in the matrix metal nickel during the electrodeposition process, the diamond fine powder we used is When the synthetic diamond is broken by ball milling, the diamond particles are spherical or polygonal. When the diamond concentration in the plating solution is increased to a certain extent, the diamond particles attached to the cathode gradually reach the bulk density value, and then the diamond concentration in the plating solution is increased. The density of the diamond particles attached to the cathode no longer increases, and therefore, the content of diamond particles in the composite film tends to be close to saturation. (3) The suspension of diamond particles is completed by stirring. During the stirring process, the diamond particles follow the fluid movement and fall down on the surface of the cathode, and the nickel ions are covered by the deposited nickel ions. The stirring speed and the position of the stirring paddle must be in the plating solution. The distribution of diamond particles has a large effect. The stirring paddle is in the lower part of the plating solution and the stirring speed reaches a certain value to enable the diamond particles to reach the bottom suspension, but if the stirring speed is too large, most of the diamond particles will not fall and stay on the cathode surface. (4) When the cathode is completely suspended vertically, the diamond particles cannot sink on the surface, and no diamond particles are deposited in the composite film. When the cathode inclination angle is small, the number of diamond particles falling on the surface is small, and the content of diamond particles in the composite film is relatively small. However, at a large inclination angle, the diamond particles in the plating solution are deposited on the surface of the cathode after being settled freely, and it is difficult to form a uniform diamond adhesion on the surface of the cathode, and it is of course impossible to form a uniform electrodeposited composite film. Moreover, due to the uneven distribution of the diamond particle concentration and the electric field in the plating solution, during the entire electroplating process, the intermittent rotation of the cathode mother plate can make the plating time of each part in the different parts of the plating solution substantially the same, so that the thickness of the composite film is uniform. (5) The higher the temperature, the faster the movement of nickel ions to the surface of the cathode, and the more diamond particles are embedded in the composite film, so the higher the composite deposition rate, the maximum at 50 °C. However, as the temperature increases further, the viscosity of the plating solution decreases, and the adhesion of the diamond particles to the surface of the cathode decreases. At this time, the moving speed of the nickel ions is not the decisive factor for the diamond particles to be wrapped in the matrix metal, so the overall The content of diamond particles is reduced. The microscopic strain in the composite film comes from the lattice defects of the nickel crystal. When the temperature is high, the nickel ions have more energy. The deposition is arranged according to the lattice regularity, and the defects are small, so the microscopic strain is small; but when the temperature is higher than Above 50 °C, the hydrogen evolution of the cathode is intensified, and excessive hydrogen adsorption on the surface of the cathode causes a large amount of hydrogen to be trapped in the composite film during nickel deposition. Once hydrogen is absorbed in the nickel lattice, the crystal lattice will be distorted and the lattice defects will increase. Causes an increase in microscopic strain. As the temperature increases, more and more hydrogen adheres to the surface of the cathode, making the composite deposition of diamond and nickel more and more difficult. Moreover, as the temperature increases, the viscosity of the plating solution decreases, causing the diamond particles in the plating solution. The amount of suspension decreases, and the embedding rate of the diamond particles decreases, resulting in a decrease in the deposition rate of the composite film. As the temperature increases, the growth rate of nickel crystallites decreases, causing a decrease in the size of nickel crystallites. 3.2 Subsequent processing of composite film After diamond-nickel composite film after electroforming, due to the edge effect during electroplating, burrs and burrs appear at the inner and outer round edges (as shown in Figure 3). If it is used directly as a cutting piece, it will inevitably cause the slit of the cut workpiece to be wide during use, which may destroy the cut workpiece, and even cause the blade and the workpiece to be broken at a very high rotation speed (30000r/min), posing a danger. . Therefore, after electroforming is removed, subsequent processing must be performed to remove the burrs and burrs at the inner and outer round edges and to machine the insert to the size of use. For this reason, the cathode pattern plating deposition area size is slightly larger than the blade use size, leaving a margin for subsequent processing. 
3.2.1 DEM processing method (EDM) principle EDM technology is a kind of electro-corrosion processing of continuous, periodic electric cremation discharge of metal conductor material in insulating medium, and can also be punched , cutting and other processing. The working system diagram of the processing system is shown in Figure 4. The partial enlargement of the EDM surface is shown in Figure 5. The diamond-nickel composite film is a metal-based composite film with good electrical conductivity and a thickness of 20-40 μm. Precision micro-machining, because the cutting piece is thin and brittle, can not be processed by conventional cutting, suitable for EDM. 
3.2.2 DEM processing results The DEM processing method is used to remove the inner and outer circles of the diamond-nickel composite film after electroforming, and the burrs and burrs are removed, and the inner and outer circular dimensions are processed to a use value of 40 mm × 51 mm. The outer outer circular appearance is shown in Fig. 6. 
4. Application of electroformed ultra-thin diamond tool 4.1 Scribing experiment The ultra-thin diamond blade made by our laboratory and the imported (DISCO) blade of the same specification are cut under the same conditions on the same machine tool. A single crystal silicon integrated circuit board, the experimental conditions are: machine parameters: machine tool spindle speed 30000r / min, cutting speed 5mm / s, cutting depth 0.35mm; cutting device: monocrystalline silicon integrated circuit board; blade specifications: 51mm × 0.025 mm × 40 mm. Then, the slit of the cut single crystal silicon integrated circuit board was photographed and compared with the metallographic microscope. It was found that the cutting efficiency was comparable to that of the DISCO blade: under the same cutting speed and cutting depth, the dicing process requirements were met. . The slit is similar to the DISCO blade: the size of the breach is basically the same. Service life: comparable to DISCO blades. Cutting width: The cutting piece of this paper is 0.048~0.053mm, and the DISCO blade is 0.045~0.050mm. 4.2 Analysis of experimental results 4.2.1 Cutting efficiency and incision collapse The cutting piece is composed of diamond particles embedded in the matrix metal nickel, in which the diamond particles are cut, the cutting efficiency and the notch collapse are determined by the cutting. The density of the diamond particles in the sheet and the holding strength of the nickel particles to the diamond particles, which are in turn controlled by the plating parameters. The density of diamond particles is high and the cutting efficiency is high, but the holding of diamond particles by nickel is weakened and the life is low; the density of diamond particles is low, the holding of diamond particles by nickel is strong, the self-sharpness of the blade is poor, the cutting efficiency is low, and the size of the slit is large. . Therefore, controlling the content of diamond particles in the composite film in an appropriate range is the key to improving the cutting efficiency of the cutting blade and reducing the size of the slit. The shape of the slit is shown in Figure 7. 
4.2.2 Slit width The surface flatness and parallelism of the cutting piece are the main factors determining the width of the slit. If the internal stress generated during the plating process is large, the composite film is deformed after the film is removed, the surface is uneven, and the slit is cut. Width; if the thickness of the deposited film is not uniform during composite plating, the parallelism of the blade is poor and the slit is wide. In this paper, the dicing sheet is cut into a single crystal silicon integrated circuit board with a slit width of 0.048 to 0.053 mm, which is 0.003 mm wider than the DISCO blade of the same specification (the width of the DISCO blade is 0.045-0.050 mm). It shows that the surface flatness and parallelism of the cut piece are poor. Because the blade is very thin, and the spindle speed of the machine tool is very high (30000r/min) during use, due to the centrifugal force during the rotation, the slit widening factor caused by the uneven surface of the cutting piece is no longer important, and the parallelism is determined. The main factor of the slit width, for this reason, the main reason for the slit width of the cut piece is that the parallelism of the composite film is poor. Figure 8 shows the comparison of the parallelism of the two. The average thickness of the imported inserts is 0.025mm (0.02454mm), the absolute error is 0.000268mm, and the relative error is 1.09%. The average thickness of the cut piece is 0.025mm (0.02619mm), the absolute error is 0.000547mm, and the relative error is 2. 08%. 
5. Conclusions and Prospects Through the development and application of electroformed ultra-thin diamond tools, the following conclusions are obtained: (1) The main electroplating process parameters affecting the quality of diamond-nickel composite film include: cathode current density, diamond content in plating solution, plating Liquid temperature, agitation speed and position, cathode suspension inclination, etc. (2) The diamond particle content, thickness uniformity, flatness (deformation) and knife edge morphology in the composite film are the main factors determining the performance of the cutting piece. (3) EDM can remove the burrs and burrs after electroplating, which is an effective follow-up processing method. In order to produce high-quality electroformed ultra-thin diamond tools, we must first study high-quality electroformed diamond-metal composite films. During the electroplating process, burrs and burrs are generated due to the edge effect, and such burrs and burrs are not allowed to exist when the dicing sheet is used. Therefore, after electroforming, the subsequent processing of the composite film is extremely important. Although the DEM processing method adopted in this paper can meet the processing requirements, the processing time is long and the processing efficiency is low. This method is not practical from the viewpoint of mass production. Exploring effective follow-up processing methods is also an important research content for us in the future. In short, electroforming ultra-thin diamond tools are a new type of cutting tool, which has great application prospects. However, to truly realize industrialization, we need to continuously explore from both theory and application to improve product quality. References [1] Cui Qiang, Xu Xiaocun, Li Baoshen. Effect of Ni-B4C composite plating process parameters on B4C content in coating [J]. Journal of Harbin University of Science and Technology. 1997, 2 (2): 35-43. [2] Fang Lizhen, Zhang Binglin, Yao Ning. Electrodeposition of diamond-metal composite film [J]. Diamond and Abrasives Engineering, 2005, 145(1): 36-41. [3] Fang Lizhen, Zhang Binglin, Yao Ning. Effect of stirring on electrodeposition results of diamond-metal composite film and hydrodynamic analysis [J]. Diamond and Abrasives Engineering, 2005, 146(2): 18-20. [4] Fang Lizhen, Zhang Binglin, Qi Jianli, et al. Prediction of deposition results of electroformed self-supporting diamond-nickel composite film by artificial neural network [J]. Rare metal materials and engineering. 2006, 35(4): 638-641. [5]Fang LL,Zhang BL,Yao N. Fabrication of Accurate Diamond-metal Composite Cutting Blade by Electrotyping Method [J]. Key Engineering Materials, 2006, 304-305: 57-61. [6] Li Qiang, Zhu Yanjuan, Zhang Zhongju, et al. Effect of temperature and stirring speed on the performance of nanometer nickel hydroxide [J]. Journal of Artificial Crystals. 2010, 39(3): 751-756. [7] Zhao Wansheng. EDM technology [M]. Harbin, Harbin Institute of Technology Press, 2000. [8] Li Zhongwen. EDM and wire cutter programming and electromechanical control [M]. Beijing: Chemical Industry Press, 2004.
Development and application of electroformed ultra-thin diamond cutter
Fang Lizhen, Zhang Yang, Liu Shiguo (School of Science, Zhongyuan University of Technology, Zhengzhou 450007, China) Abstract: The research status of ultra-thin diamond tools was analyzed. The diamond-nickel composite film was prepared by electroforming process. The cathode current density, stirring speed and stirring were discussed. The influence of plating process parameters such as paddle position, cathode suspension inclination and bath temperature on the quality of diamond-nickel composite film; the subsequent processing technology of composite film was discussed, and it was pointed out that EDM can effectively remove the burrs and burrs of composite film. An effective follow-up processing method; an ultra-thin diamond-nickel composite film cutting sheet was developed, and a preliminary trial study on its cutting performance was carried out. Key words: electroforming; ultra-thin diamond tool; diamond-nickel composite film; EDM; application CLC number: TQ164 Document code: AArticle ID: 1000-985X(2011)03-0610-06 1·Introduction Ultra-thin diamond tools are mainly used for cutting and slotting various integrated circuit chips and various electronic components in the electronic information industry. The thickness of the cutting piece is thin (generally 0.015~0.1mm); high precision (thickness dimension accuracy is generally <0.003mm, roundness and concentricity <0.01mm, parallelism <0.005mm); strength High; good rigidity; low internal stress (working line speed of up to 100m / s). The utility model has the advantages of high cutting speed, small slit, small collapse, high material utilization rate, high workpiece precision and good surface quality, and can fully meet the needs of processing large-scale integrated circuit chips and various electronic components in the electronic information field. At present, there are two main methods for the development of ultra-thin diamond tools, namely, pressing method and electroforming method. The electroforming method has lower advantages than the pressing method, the equipment is simple, and the developed tool is thinner, so it has more advantages. At present, ultra-thin diamond tools have been developed by electroforming. Only a few Japanese companies such as DISCO, Mitsubishi, and Shinhan in Korea have been used in foreign countries. Only a few research units in China are researching and developing this work. It is still in its infancy. The development of electroformed ultra-thin diamond cutters can improve the manufacturing level of China's tool industry, replace imports, and play a positive role in promoting the development of China's electronic information industry. 2. Research Status of Ultra-thin Diamond Tools 2.1 Development Methods of Ultra-thin Diamond Tools At present, there are two main methods for the development of ultra-thin diamond tools, namely, pressing method and electroforming method. 2.1.1 Pressing method The powder metallurgy principle is adopted, and the thickness is greater than 0.08 mm. The thickness dimension accuracy is ±0.002~±0.005mm, and the parallelism is less than 0.005mm. Its main characteristics are high precision, good rigidity, high cutting sharpness, and the use speed can reach about 80m/s. A wide range of materials that can be used in a variety of magnetic head materials, substrates, glass, ceramics, crystals, hard alloys, ceramic-metal composites, resin-ceramic composites, resin-ceramic-metal composites, and metal compounds. Cut and slot. 2.1.2 Electroforming method utilizes the principle of electrochemistry, the thickness is less than 0.1mm, the thickness dimension accuracy is ±0.001～±0.002mm, the parallelism is less than 0.005mm (same as the pressing method), main features: Higher precision, higher strength, better rigidity, narrower slit, good thermal conductivity, high wear resistance, speed of use up to 100m/s, but shallow depth (generally less than 1mm), mainly used in various chips The cutting and grooving, the range of materials that can be processed is relatively narrow, and is mainly used for processing semiconductor materials such as silicon, gallium arsenide, and indium phosphide. 2.2 Application At present, the production of ultra-thin diamond tools by the pressing method has been produced by a few research units and manufacturers in Zhengzhou Abrasives Research Institute. The products can replace imported products. The ultra-thin diamond cutters produced by electroforming have mainly relied on imports for domestic applications, and domestic research units are still in the development stage. 3. Development of electroformed ultra-thin diamond tool The development process of electroformed ultra-thin diamond tool is divided into two important parts: the preparation of diamond-nickel composite film and the subsequent processing of composite film. 3.1 Preparation of diamond-nickel composite film 3.1.1 Composite plating equipment Figure 1 is a simplified diagram of our own composite plating equipment, mainly composed of constant current source, constant temperature water bath, plating tank, stirrer and so on.