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Yong Kuan KE-3837 one-component epoxy adhesive low temperature thermosetting adhesive
Low Viscosity Infiltration Epoxy Adhesive Low Temperature Cure Epoxy Adhesive High Strength One Component Epoxy Adhesive BGA Chip Underfill Adhesive Chip Package Epoxy Adhesive COB Enclosure Glue Precision Electronic Adhesive Epoxy Adhesive Low Temperature Thermoset Adhesive Electronic Chip Adhesive Single Liquid Epoxy Resin Adhesive KE-3837 Product Brief KE-3837 is a one-component epoxy resin adhesive developed for electronic components. This product has a good adhesion force after hardening. This product is a low-temperature-hardening resin and is suitable for use between various materials. It is superior to plastics. The resin has excellent durability and is suitable for the assembly of memory cards and C-MOS and the thermal sensors through many different environmental tests. One-component Epoxy Adhesive KE-3837 Features (8600086.cn): 1. This product is a solvent-free single-liquid epoxy resin. 2. The resin has low viscosity and good operability. 3. The surface of the resin cured product does not appear greasy, and the cured product exhibits low gloss. 4. The product still has good electrical insulation properties under high humidity conditions. 5. The resin has good resistance to chemicals and solvents after hardening. 6. Hardened products have excellent protection and shock resistance to the components. 7. This product complies with the 2011/65/EU RoHS regulations. 8. This product complies with chlorine