What is the slow rate of tin plating deposition?

Stannous sulfate is the main salt in the bright tin plating solution, which provides a source of tin ions. The content of the tin oxide has a great influence on the allowable current density in the plating and tin plating process. Increasing the stannous ion concentration within the allowable range can increase the cathode accordingly. The current density is beneficial to speed up the deposition speed of the coating and correspondingly increase the production efficiency. However, when the concentration of stannous ions is too high or too low, it will have the following adverse effects on the quality of the coating.

(1) The main symptoms appearing when the content of stannous sulfate is too high: the dispersing ability of the plating solution is lowered; the plating layer is rough and the color is dim; the range of the bright region is narrowed.

(2) Symptoms when the stannous sulfate content is too low: the allowable current density range is significantly reduced; the plating deposition rate is slow; the production efficiency is correspondingly reduced; the plating layer is easily burnt. The fault was originally estimated to be caused by excessive current density, but it was considered that the tin plating layer was not rough, and the phenomenon of the current density was not changed, so the analysis was performed. It was found that the stannous sulfate content was less than 30 g/L, and it was found that the anode was passivated. The reduction of the tin content in the original solution was caused by anode passivation. According to further analysis, the anode passivation was originally performed by self-fusion of the tin. Therefore, when the anode tin head is returned to the furnace, a special pot should be used. It should not be mixed with other metal melting pots, and should be carefully inspected to avoid mixing with cadmium, lead, zinc and other metals similar to tin.

It can be seen that the importance of maintaining the purity of the anode in the tin plating process.

The purity of the tin anode should not be lower than 99.9%, otherwise it will contaminate the plating solution in addition to easily causing passivation. For this purpose, the anode plate must also use an anode pouch to prevent the anode mud from contaminating the solution.

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